Chemical Solution Deposition

item

PZT- and Lead-free Thin Film Coating Services

  • Composition : Customers' preference (including dopants)
  • Target thickness : 100 nm ~ 5 um
  • Substrate size : Sample size ~ 6 inch
  • Standard substrate : Pt/Ti/SiO2/Si, Pt/Ti on SOI wafer or other MEMS structured wafers
  • Basic data and process flow chart will be provided
item

MEMS Foundry

item

Surface & Bulk Micromachining Process

Process/Equipment

Process Equipment Note
Photolithography Spin Coater & Track System Sample ~ 8 inch
Mask Aligner Sample ~ 6 inch
Wet Station & Spin Dryer
Plasma Asher & Cleaner
Chemical Vapor
Deposition
PECVD Poly Silicon, SiO2, Si3N4
E-beam Lithography E-beam Evaporator 4 ~ 8 inch / Au, Cu, N, Al, etc
Dry Etcher DRIE & ICP Etcher Si, Oxide & Metal film etch
Ion Beam Etching System 4 ~ 8 inch
Oxidation Diffusion Furnace 2 ~ 8 inch
Others SAM & AAO System
Dicing Saw
Electro-plate machine
Anodic Bonder, Bonding Aligner & Wire Bonder
Grinding / Polishing Machine





item